Материал: 9643

Triacs

BT134W series D

logic level

GENERAL DESCRIPTION

QUICK REFERENCE DATA

Glass passivated, sensitive gate triacs

SYMBOL

PARAMETER

MAX.

MAX.

UNIT

in a plastic envelope suitable for

BT134W-

500D

600D

surface mounting, intended for use in

general

purpose

bidirectional

VDRM

Repetitive peak off-state voltages

500

600

V

switching

and

phase

control

IT(RMS)

RMS on-state current

1

1

A

applications.

These

devices are

ITSM

Non-repetitive peak on-state current

10

10

A

intended to be interfaced

directly to

microcontrollers,

logic

integrated

circuits and other low power gate

trigger circuits.

PINNING - SOT223

PIN CONFIGURATION

SYMBOL

PIN

DESCRIPTION

4

1

main terminal 1

T2

T1

2

main terminal 2

3

gate

G

1

2

3

tab

main terminal 2

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

-500

-600

V

Repetitive peak off-state

-

5001

6001

V

DRM

voltages

full sine wave; Tsp ≤ 108 ˚C

IT(RMS)

RMS on-state current

-

1

A

ITSM

Non-repetitive peak

full sine wave; Tj = 125 ˚C prior

on-state current

to surge; with reapplied VDRM(max)

-

10

A

t = 20 ms

t = 16.7 ms

-

11

A

I2t

I2t for fusing

t = 10 ms

-

0.5

A2s

dIT/dt

Repetitive rate of rise of

ITM = 1.5 A; IG = 0.2 A;

on-state current after

dIG/dt = 0.2 A/μs

A/μs

triggering

T2+ G+

-

50

T2+ G-

-

50

A/μs

T2- G-

-

50

A/μs

T2- G+

-

10

A/μs

IGM

Peak gate current

-

2

A

VGM

Peak gate voltage

-

5

V

PGM

Peak gate power

-

5

W

PG(AV)

Average gate power

over any 20 ms period

-

0.5

W

Tstg

Storage temperature

-40

150

˚C

Tj

Operating junction

-

125

˚C

temperature

February 1996

1

Rev 1.100

Triacs

BT134W series D

logic level

THERMAL RESISTANCES

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Rth j-sp

Thermal resistance

full or half cycle

-

-

15

K/W

junction to solder point

Rth j-a

Thermal resistance

pcb mounted; minimum footprint

-

156

-

K/W

junction to ambient

pcb mounted; pad area as in fig:14

-

70

-

K/W

STATIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

IGT

Gate trigger current

VD = 12 V; IT = 0.1 A

-

2.0

5

mA

T2+ G+

T2+ G-

-

2.5

5

mA

T2- G-

-

2.5

5

mA

T2- G+

-

5.0

10

mA

IL

Latching current

VD = 12 V; IGT = 0.1 A

-

1.6

10

mA

T2+ G+

T2+ G-

-

4.5

15

mA

T2- G-

-

1.2

10

mA

T2- G+

-

2.2

15

mA

IH

Holding current

VD = 12 V; IGT = 0.1 A

-

1.2

10

mA

VT

On-state voltage

IT = 2 A

-

1.2

1.5

V

VGT

Gate trigger voltage

VD = 12 V; IT = 0.1 A

-

0.7

1.5

V

VD = 400 V; IT = 0.1 A; Tj = 125 ˚C

0.25

0.4

-

V

ID

Off-state leakage current

VD = VDRM(max); Tj = 125 ˚C

-

0.1

0.5

mA

DYNAMIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

dVD/dt

Critical rate of change of

VDM = 67% VDRM(max); Tj = 125 ˚C;

-

5

-

V/μs

off-state voltage

exponential waveform; RGK = 1 kΩ

μs

tgt

Gate controlled turn-on

ITM = 1.5 A; VD = VDRM(max); IG = 0.1 A;

-

2

-

time

dIG/dt = 5 A/μs

February 1996

2

Rev 1.100

Philips Semiconductors

Product specification

Triacs

BT134W series D

logic level

February 1996

3

Rev 1.100

Philips Semiconductors

Product specification

Triacs

BT134W series D

logic level

February 1996

4

Rev 1.100

Triacs

BT134W series D

logic level

MOUNTING INSTRUCTIONS

PRINTED CIRCUIT BOARD

Dimensions in mm.

Dimensions in mm.

3.8

36

min

1.5

18

min

60

4.6

4.5

9

2.3

6.3

1.5

min

10

(3x)

1.5

min

4.6

7

15

50

Fig.13. soldering pattern for surface mounting

Fig.14. PCB for thermal resistance and power rating

SOT223.

for SOT223.

PCB: FR4 epoxy glass (1.6 mm thick), copper

laminate (35 μm thick).

February 1996

5

Rev 1.100