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DISCRETE SEMICONDUCTORS

book, halfpage

M3D088

BAS116

Low-leakage diode

Product specification

1996 Mar 13

Supersedes data of June 1994

File under Discrete Semiconductors, SC01

Philips Semiconductors

 

Product specification

 

 

 

Low-leakage diode

 

BAS116

 

 

 

 

 

 

FEATURES

PINNING

 

Plastic SMD package

 

 

PIN

DESCRIPTION

Low leakage current: typ. 3 pA

 

 

1

anode

 

Switching time: typ. 0.8 μs

 

 

2

not connected

Continuous reverse voltage:

 

 

3

cathode

max. 75 V

 

 

 

 

Repetitive peak reverse voltage: max. 85 V

Repetitive peak forward current: max. 500 mA.

APPLICATION

Low leakage current applications in surface mounted circuits.

DESCRIPTION

Epitaxial medium-speed switching diode with a low leakage current in a small plastic SOT23 SMD package.

handbook, 4 columns

 

 

2

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

n.c.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

 

 

 

 

 

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Top view

 

 

 

 

 

 

 

 

 

 

MAM106

Marking code: JVp.

Fig.1 Simplified outline (SOT23) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

 

 

 

 

 

 

VRRM

repetitive peak reverse voltage

 

85

V

VR

continuous reverse voltage

 

75

V

IF

continuous forward current

see Fig.2; note 1

215

mA

IFRM

repetitive peak forward current

 

500

mA

IFSM

non-repetitive peak forward current

square wave; Tj = 25 °C prior to surge;

 

 

 

 

 

see Fig.4

 

 

 

 

 

tp = 1 μs

4

A

 

 

tp = 1 ms

1

A

 

 

tp = 1 s

0.5

A

Ptot

total power dissipation

Tamb = 25 °C; note 1

250

mW

Tstg

storage temperature

 

65

+150

°C

Tj

junction temperature

 

150

°C

Note

1. Device mounted on a FR4 printed-circuit board.

1996 Mar 13

2

Philips Semiconductors

 

 

Product specification

 

 

 

 

 

 

 

Low-leakage diode

 

 

 

BAS116

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS

 

 

 

 

 

Tj = 25 °C unless otherwise specified.

 

 

 

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

TYP.

 

MAX.

UNIT

 

 

 

 

 

 

 

VF

forward voltage

see Fig.3

 

 

 

 

 

 

IF = 1 mA

 

900

mV

 

 

IF = 10 mA

 

1000

mV

 

 

IF = 50 mA

 

1100

mV

 

 

IF = 150 mA

 

1250

mV

IR

reverse current

see Fig.5

 

 

 

 

 

 

VR = 75 V

0.003

 

5

nA

 

 

VR = 75 V; Tj = 150 °C

3

 

80

nA

Cd

diode capacitance

f = 1 MHz; VR = 0; see Fig.6

2

 

pF

trr

reverse recovery time

when switched from IF = 10 mA to

0.8

 

3

μs

 

 

IR = 10 mA; RL = 100 Ω;

 

 

 

 

 

 

measured at IR = 1 mA; see Fig.7

 

 

 

 

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

 

CONDITIONS

VALUE

UNIT

 

 

 

 

 

 

Rth j-tp

thermal resistance from junction to tie-point

 

 

330

K/W

Rth j-a

thermal resistance from junction to ambient

note 1

 

500

K/W

Note

1. Device mounted on a FR4 printed-circuit board.

1996 Mar 13

3

Philips Semiconductors

Product specification

 

 

Low-leakage diode

BAS116

 

 

GRAPHICAL DATA

 

 

 

 

 

 

 

 

 

 

MLB755

300

 

 

 

MLB752 - 1

300

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

handbook, halfpage

 

 

 

 

handbook, halfpage

 

 

 

 

 

 

 

 

I F

 

 

 

I F

 

 

 

 

(mA)

 

 

 

(mA)

 

 

 

 

200

 

 

 

200

 

(1)

(2)

(3)

 

 

 

 

 

 

100

 

 

 

100

 

 

 

 

0

 

 

 

0

 

 

 

 

0

100

Tamb ( oC)

200

 

 

 

 

0

0.4

0.8

1.2

1.6

 

 

 

 

 

 

 

 

VF (V)

 

(1)

Tj = 150 °C; typical values.

Device mounted on a FR4 printed-circuit board.

(2)

Tj

= 25

°C; typical values.

(3)

Tj = 25

°C; maximum values.

 

Fig.2 Maximum permissible continuous forward

Fig.3

Forward current as a function of forward

current as a function of ambient temperature.

 

 

voltage.

MBG704

102

IFSM

(A)

10

1

101

1

10

102

103

tp (μs)

104

 

 

 

 

 

Based on square wave currents; Tj = 25 °C prior to surge.

Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.

1996 Mar 13

4

Philips Semiconductors

Product specification

 

 

Low-leakage diode

BAS116

 

 

10

2

 

 

MLB754

 

 

 

 

MBG526

 

 

 

 

 

2

 

 

 

 

 

 

 

 

 

 

 

 

handbook, halfpage

 

 

 

 

 

handbook, halfpage

 

 

 

 

I R

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(nA)

 

 

 

 

 

 

Cd

 

 

 

 

10

(1)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(pF)

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

10 1

 

 

 

 

 

 

 

 

 

 

10 2

(2)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10 3

 

 

 

 

 

0

 

 

 

VR (V) 20

 

0

50

100

150

o

200

0

5

10

15

 

 

 

 

T j (

 

C)

 

 

 

 

 

VR = 75 V.

 

 

 

 

 

f = 1 MHz; Tj = 25 °C.

 

 

 

Fig.5 Reverse current as a function of junction

Fig.6 Diode capacitance as a function of reverse

temperature.

voltage; typical values.

 

 

 

 

t r

t p

 

 

 

 

 

 

t

 

 

 

 

D.U.T.

10%

 

 

R

= 50 Ω

IF

 

I F

t rr

S

 

 

 

SAMPLING

 

t

 

 

 

 

OSCILLOSCOPE

 

 

 

 

 

 

 

V = VR

IF x R S

 

R i = 50 Ω

 

 

 

 

 

 

 

90%

(1)

 

 

 

 

VR

 

 

 

 

 

 

 

 

 

 

 

MGA881

 

 

input signal

output signal

Fig.7 Reverse recovery time test circuit and waveforms.

1996 Mar 13

5

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