Материал: 4HC4016

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MC54/74HC4016

VCC
				VCC	VCC			VCC
GND			14		VCC		14
	A				A		ON	N/C
VCC	A		OFF		GND
			SELECTED	VIL			SELECTED	VIH
		7	CONTROL			7	CONTROL
		7	INPUT			7	INPUT
			INPUT				INPUT
Figure 3. Maximum Off Channel Leakage Current,					Figure 4. Maximum On Channel Leakage Current,
	Any One Channel, Test Set±Up				Channel to Channel, Test Set±Up

		V	VOS
		CC
		14
fin		ON		dB
	0.1μF		CL*	dB
	0.1μF			METER
				METER
		SELECTED	VCC
	7	CONTROL
	7	INPUT
		INPUT

*Includes all probe and jig capacitance.

Figure 5. Maximum On±Channel Bandwidth

Test Set±Up

	V	V	VOS
	IS	CC
		14
fin		OFF		dB
0.1μF			CL*	dB
0.1μF	RL			METER
	RL			METER

SELECTED

CONTROL

INPUT

*Includes all probe and jig capacitance.

Figure 6. Off±Channel Feedthrough Isolation,

Test Set±Up

V		VCC	V
CC/2			CC/2
		14
RL			RL
		OFF/ON	VOS
		OFF/ON	IS
			CL*
		SELECTED
Vin ≤ 1 MHz	7	CONTROL
Vin ≤ 1 MHz	7	INPUT
tr = tf = 6 ns
VCC	CONTROL
GND	CONTROL
GND

*Includes all probe and jig capacitance.

Figure 7. Feedthrough Noise, ON/OFF Control to Analog Out, Test Set±Up

VCC

50%

ANALOG IN

GND

tPLH

tPHL

50%

ANALOG OUT

Figure 8. Propagation Delays, Analog In to Analog Out

MOTOROLA

MC54/74HC4016

VCC

ANALOG IN

ANALOG OUT TEST

POINT

SELECTED

CL*

VCC

CONTROL

INPUT

*Includes all probe and jig capacitance.

CONTROL	90%		VCC
CONTROL	50%
	50%
	10%		GND
	tPZL	tPLZ	HIGH
			HIGH
	50%		IMPEDANCE
	50%	10%
		10%	VOL
ANALOG			VOL
ANALOG	tPZH	tPHZ
OUT	tPZH	tPHZ	VOH
	50%	90%	VOH
	50%		HIGH
			HIGH
			IMPEDANCE

Figure 9. Propagation Delay Test Set±Up	Figure 10. Propagation Delay, ON/OFF Control
	to Analog Out

	POSITION	1 WHEN TESTING tPHZ AND tPZH
1	POSITION	2 WHEN TESTING tPLZ AND tPZL
2		VCC
VCC		VCC
VCC		14	1 kΩ
1			TEST
		ON/OFF	TEST
2		ON/OFF	POINT
2			POINT
			CL*
	SELECTED
	CONTROL
	INPUT
	7

*Includes all probe and jig capacitance.

Figure 11. Propagation Delay Test Set±Up

VCC

NC		OFF/ON			NC

SELECTED 7 CONTROL INPUT

ON/OFF CONTROL

Figure 13. Power Dissipation Capacitance

Test Set±Up

VIS		VCC
		VCC
RL		14			VOS
RL					VOS
fin	ON
0.1 μF
	OFF
VCC OR GND		RL	CL*	RL	CL*
RL	SELECTED
	SELECTED
	CONTROL	VCC/2		VCC/2
	INPUT	VCC/2		VCC/2
	INPUT
	7
VCC/2
*Includes all probe and jig capacitance

Figure 12. Crosstalk Between Any Two Switches,

Test Set±Up

VIS	VCC		V
			OS
0.1 μF				TO
fin				TO
fin	ON			DISTORTION
		RL	CL*	METER
		VCC/2
	SELECTED	VCC
7	CONTROL
	INPUT

*Includes all probe and jig capacitance.

Figure 14. Total Harmonic Distortion, Test Set±Up

MOTOROLA

MC54/74HC4016

	0
	± 10	FUNDAMENTAL FREQUENCY
	± 20
	± 30
dBm	± 40
dBm	± 50	DEVICE
	± 50
	± 60
	± 60	SOURCE
	± 70	SOURCE
	± 70
	± 80
	± 90
	± 100	2.0	3.0
	1.0	2.0	3.0
		FREQUENCY (kHz)

Figure 15. Plot, Harmonic Distortion

APPLICATION INFORMATION

The ON/OFF Control pins should be at VCC or GND logic levels, VCC being recognized as logic high and GND being recognized as a logic low. Unused analog inputs/outputs may be left floating (not connected). However, it is advisable to tie unused analog inputs and outputs to VCC or GND through a low value resistor. This minimizes crosstalk and feedthrough noise that may be picked up by the unused I/O pins.

The maximum analog voltage swings are determined by the supply voltages VCC and GND. The positive peak analog voltage should not exceed VCC. Similarly, the negative peak analog voltage should not go below GND. In the example

below, the difference between VCC and GND is twelve volts. Therefore, using the configuration in Figure 16, a maximum analog signal of twelve volts peak±to±peak can be controlled.

When voltage transients above VCC and/or below GND are anticipated on the analog channels, external diodes (Dx) are recommended as shown in Figure 17. These diodes should be small signal, fast turn±on types able to absorb the maximum anticipated current surges during clipping. An alternate method would be to replace the Dx diodes with MO sorbs (Motorola high current surge protectors). MO sorbs are fast turn±on devices ideally suited for precise DC protection with no inherent wear±out mechanism.

VCC = 12 V

+ 12 V

ANALOG I/O

ANALOG O/I

0 V

+ 12 V

SELECTED

CONTROL

OTHER CONTROL

INPUT

INPUTS

(VCC OR GND)

Figure 16. 12 V Application

VCC		VCC
Dx	14	Dx
	ON

VCC

SELECTED

CONTROL

OTHER CONTROL

INPUT

INPUTS

(VCC OR GND)

Figure 17. Transient Suppressor Application

MOTOROLA

									MC54/74HC4016
+ 5 V							+ 5 V
	ANALOG		14		ANALOG			ANALOG	14	ANALOG
	ANALOG				ANALOG			ANALOG		ANALOG
	SIGNALS				SIGNALS			SIGNALS		SIGNALS
R*	R* R* R*	HC4016						HCT	HC4016
LSTTL/							LSTTL/	BUFFER
NMOS	5						NMOS	5
	6	CONTROL						6	CONTROL
		CONTROL							CONTROL
	14	INPUTS						14	INPUTS
	15		7					15	7
			7						7
	R* = 2 TO 10 kΩ
a. Using Pull-Up Resistors								b. Using HCT Buffer
			Figure 18. LSTTL/NMOS to HCMOS Interface
			VDD = 5 V				VCC = 5 TO 12 V
		13	1	16	ANALOG		14	ANALOG
		3			SIGNALS			SIGNALS
		5					HC4016
		7	MC14504		2	5
		9			4	6	CONTROL
		11			6	14	INPUTS
		14	8		10	15	7
			8				7

Figure 19. TTL/NMOS±to±CMOS Level Converter Analog Signal Peak±to±Peak Greater than 5 V (Also see HC4316)

CHANNEL 4

1 OF 4

SWITCHES

CHANNEL 3

1 OF 4

SWITCHES

COMMON I/O

CHANNEL 2

1 OF 4

SWITCHES

CHANNEL 1

1 OF 4

OUTPUT

SWITCHES

INPUT

SWITCHES

EQUIVALENT

0.01 μF

CONTROL INPUTS

MOTOROLA

MC54/74HC4016

OUTLINE DIMENSIONS

J SUFFIX

CERAMIC DIP PACKAGE

-A-

CASE 632±08

ISSUE Y

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

-B-

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMESNION F MAY NARROW TO 0.76 (0.030)

WHERE THE LEAD ENTERS THE CERAMIC

BODY.

INCHES

MILLIMETERS

DIM

MIN

MAX

MIN

MAX

0.750

0.785

19.05

19.94

0.245

0.280

6.23

7.11

-T-

0.155

0.200

3.94

5.08

0.015

0.020

0.39

0.50

SEATING

0.055

0.065

1.40

1.65

PLANE

0.100 BSC

2.54 BSC

0.008

0.015

0.21

0.38

D 14 PL

J 14 PL

0.125

0.170

3.18

4.31

0.300 BSC

7.62 BSC

0.25 (0.010)

0°

15°

0°

15°

0.020

0.040

0.51

1.01

N SUFFIX

PLASTIC DIP PACKAGE

CASE 646±06

ISSUE L

14		8
			B
1		7
	A
	F			L
				C
			N	J
			N
			SEATING	K
H	G	D	PLANE	K
			PLANE	M
				M

NOTES:

1.LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION.

2.DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.

3.DIMENSION B DOES NOT INCLUDE MOLD FLASH.

4.ROUNDED CORNERS OPTIONAL.

	INCHES		MILLIMETERS
DIM	MIN	MAX	MIN	MAX
A	0.715	0.770	18.16	19.56
B	0.240	0.260	6.10	6.60
C	0.145	0.185	3.69	4.69
D	0.015	0.021	0.38	0.53
F	0.040	0.070	1.02	1.78
G	0.100 BSC		2.54 BSC
H	0.052	0.095	1.32	2.41
J	0.008	0.015	0.20	0.38
K	0.115	0.135	2.92	3.43
L	0.300 BSC		7.62 BSC
M	0	10	0	10
N	0.015	0.039	0.39	1.01

	D SUFFIX
	PLASTIC SOIC PACKAGE
	CASE 751A±03
±A±	ISSUE F

14 8

±B±

P 7 PL

1	0.25 (0.010) M	B M
1	7

	G				C		R X 45°		F
							R X 45°

SEATING	D 14 PL			K				M	J
SEATING				K				M
PLANE
PLANE	0.25 (0.010)		T	B		A
	0.25 (0.010)	M	T	B	S	A	S

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: MILLIMETER.

3.DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4.MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5.DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.

	MILLIMETERS		INCHES
DIM	MIN	MAX	MIN	MAX
A	8.55	8.75	0.337	0.344
B	3.80	4.00	0.150	0.157
C	1.35	1.75	0.054	0.068
D	0.35	0.49	0.014	0.019
F	0.40	1.25	0.016	0.049
G	1.27	BSC	0.050	BSC
J	0.19	0.25	0.008	0.009
K	0.10	0.25	0.004	0.009
M	0°	7°	0°	7°
P	5.80	6.20	0.228	0.244
R	0.25	0.50	0.010	0.019

MOTOROLA

Источник: https://studfile.net/preview/16503025/

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