Материал: ADM223

24-Lead SOIC (R-24)

28-Lead SSOP (RS-28)

0.608 (15.45)

0.407 (10.34)

0.596 (15.13)

0.397 (10.08)

24

13

28

15

0.299 (7.6)

0.212 (5.38)

0.291 (7.39)

0.205 (5.207)

0.414 (10.52)

PIN 1

0.311 (7.9)

0.398 (10.10)

1

12

PIN 1

0.301 (7.64)

1

14

0.096 (2.44)

0.03 (0.76)

0.07 (1.78)

0.089 (2.26)

0.02 (0.51)

0.066 (1.67)

6

0.042 (1.067)

8

0.037 (0.94)

0.01 (0.254)

0.05 (1.27)

0.019 (0.49)

0.013 (0.32)

0

0.018 (0.447)

0.006 (0.15)

BSC

0.014 (0.35)

0.008 (0.203)

0.0256 (0.65)

0

0.022 (0.559)

0.009 (0.23)

0.009 (0.229)

0.002 (0.050)

BSC

1. LEAD NO. 1 IDENTIFIED BY A DOT.

0.005 (0.127)

2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

1. LEAD NO. 1 IDENTIFIED BY A DOT.

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS

2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS

Location

Page

05/01

Data Sheet changed from REV. A to REV. B.

Edits to Test Conditions/Comments of Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 2

Location

Page

01/01

Data Sheet changed from REV. 0 to REV. A.

Removed ESD information from FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 1

SPECIFICATIONS changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 2

Removed ESD information from ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . 2

–16–

REV. B