DISCRETE SEMICONDUCTORS
BGY120A; BGY120B; BGY120D
UHF amplifier modules
Objective specification |
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1996 May 29 |
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File under Discrete Semiconductors, SC09 |
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Philips Semiconductors |
Objective specification |
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UHF amplifier modules
BGY120A; BGY120B;
BGY120D
FEATURES
·Single 3.6 V nominal supply voltage
·1.2 W output power
·Easy control of output power by DC voltage
·Very high efficiency (typ. 55%)
·Silicon bipolar technology
·Standby current less than 100 mA.
APPLICATIONS
·Hand-held transmitting equipment operating in the 824 to 849 MHz, 872 to 905 MHz and 898 to 928 MHz frequency ranges.
DESCRIPTION
The BGY120A, BGY120B, and BGY120D are three-stage UHF amplifier modules in a SOT388A package.
Each module consists of three NPN silicon planar transistor dies, mounted together with matching and bias components on a metallized ceramic substrate.
The modules produce an output power of 1.2 W into a load of 50 W with an RF drive power of 2 mW.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C.
PINNING - SOT388A
PIN |
DESCRIPTION |
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1 |
RF input |
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2 |
VC |
3 |
VS |
4 |
RF output |
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Flange |
ground |
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4 |
Top view |
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MSA486 |
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Fig.1 Simplified outline.
TYPE |
MODE OF |
f |
VS |
PL |
GP |
h |
ZS; ZL |
NUMBER |
OPERATION |
(MHz) |
(V) |
(W) |
(dB) |
(%) |
(W) |
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BGY120A |
CW |
824 to 849 |
3.6 |
1.2 |
³ 27.8 |
typ. 55 |
50 |
BGY120B |
CW |
872 to 905 |
3.6 |
1.2 |
³ 27.8 |
typ. 55 |
50 |
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BGY120D |
CW |
898 to 928 |
3.6 |
1.2 |
³ 27.8 |
typ. 55 |
50 |
1996 May 29 |
2 |
Philips Semiconductors Objective specification
UHF amplifier modules |
BGY120A; BGY120B; |
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BGY120D |
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LIMITING VALUES |
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In accordance with the Absolute Maximum Rating System (IEC 134). |
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SYMBOL |
PARAMETER |
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MIN. |
MAX. |
UNIT |
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VS |
DC supply voltage |
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5.5 |
V |
VC |
DC control voltage |
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3.5 |
V |
PD |
input drive power |
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5 |
mW |
PL |
load power |
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1.6 |
W |
Tstg |
storage temperature |
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−40 |
+100 |
°C |
Tmb |
operating mounting base temperature |
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−30 |
+100 |
°C |
CHARACTERISTICS
ZS = ZL = 50 Ω; PD = 2 mW; VS = 3.6 V; VC ≤ 3 V; Tmb = 25 °C; unless otherwise specified.
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
TYP. |
MAX. |
UNIT |
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f |
frequency |
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BGY120A |
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824 |
− |
849 |
MHz |
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BGY120B |
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872 |
− |
905 |
MHz |
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BGY120D |
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898 |
− |
928 |
MHz |
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IQ |
total quiescent current |
VC = 0; PD < −60 dBm |
− |
− |
100 |
μA |
IC |
control current |
adjust VC for PL = 1.2 W |
− |
− |
500 |
μA |
PL |
load power |
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1.2 |
− |
− |
W |
Gp |
power gain |
adjust VC for PL = 1.2 W |
27.8 |
− |
− |
dB |
η |
efficiency |
adjust VC for PL = 1.2 W |
50 |
55 |
− |
% |
H2 |
second harmonic |
adjust VC for PL = 1.2 W |
− |
− |
−40 |
dBc |
H3 |
third harmonic |
adjust VC for PL = 1.2 W |
− |
− |
−40 |
dBc |
VSWRin |
input VSWR |
adjust VC for PL = 1.2 W |
− |
− |
3 : 1 |
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stability |
PD = 0 to +6 dBm; VS = 3 to 4.8 V; |
− |
− |
−60 |
dBc |
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VC = 0 to 3 V; PL ≤ 1.2 W; |
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VSWR ≤ 6 : 1 through all phases |
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isolation |
VC = 0 |
− |
− |
−40 |
dBm |
Pn |
noise power |
adjust VC for PL = 1.2 W; |
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− |
−90 |
dBm |
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bandwidth = 30 kHz; |
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fn = fo + 45 MHz |
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ruggedness |
VS = 4.8 V; |
no degradation |
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adjust VC for PL = 1.4 W; |
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VSWR ≤ 10 : 1 through all phases |
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1996 May 29 |
3 |
Philips Semiconductors |
Objective specification |
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UHF amplifier modules
BGY120A; BGY120B;
BGY120D
SOLDERING
The indicated temperatures are those at the solder |
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MLB740 |
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interfaces. |
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300 |
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handbook, halfpage |
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Advised solder types are types with a liquidus less than or |
Tmb |
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equal to 210 °C. |
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o |
C) |
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( |
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Solder dots or solder prints must be large enough to wet |
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200 |
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the contact areas. |
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Footprints for soldering should cover the module contact |
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area +0.1 mm on all sides. |
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Soldering can be carried out using a conveyor oven, a hot |
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100 |
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air oven, an infrared oven or a combination of these ovens. |
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Hand soldering must be avoided because the soldering |
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iron tip can exceed the maximum permitted temperature of |
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250 °C and damage the module. |
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The maximum temperature profile and soldering time is |
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0 |
100 |
200 |
300 t (s) 400 |
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indicated as follows (see Fig.2): |
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t = 350 s at 100 °C |
Fig.2 |
Maximum allowable temperature profile. |
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t = 300 s at 125 °C |
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t = 200 s at 150 °C |
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t = 100 s at 175 °C |
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t = 50 s at 200 °C |
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t = 5 s at 250 °C (maximum temperature). |
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Cleaning |
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The following fluids may be used for cleaning: |
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∙ |
Alcohol |
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∙ |
Bio-Act (Terpene Hydrocarbon) |
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∙ |
Triclean B/S |
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∙ |
Acetone. |
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Ultrasonic cleaning should not be used since this can cause serious damage to the product.
1996 May 29 |
4 |
UHF amplifier modules
PACKAGE OUTLINE
handbook, full pagewidth |
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17.3 |
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16.9 |
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0.2 |
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17.1 |
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max |
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16.7 |
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Philips Semiconductors |
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0.15 |
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Objective specification |
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BGY120A; BGY120B; |
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BGY120D |
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2.2 |
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1.8 |
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7.7 |
12.2 |
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7.3 |
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11.8 |
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0.7 |
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0.3 |
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3.45 |
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3.05 |
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1 |
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3 |
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0.30 |
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0.56 |
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0.20 |
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(4×) |
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0.46 |
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0.25 M |
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2.3 |
5.08 |
5.08 |
2.54 |
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(4×) |
MSA485 |
1.9 |
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Dimensions in mm.
Fig.3 SOT388A.
1996 May 29 |
5 |