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Philips Semiconductors

Product specification

 

 

Wideband amplifier module

OM2050

 

 

1

0.5

2

0.2

 

 

 

 

 

 

 

5

 

 

 

700

 

 

 

 

 

 

 

 

860 MHz

 

 

10

+ j

 

500

 

 

 

 

 

 

 

 

 

 

 

0

0.5

 

1

 

2

5

10

0.2

300

100

 

– j

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

0.2

 

 

 

 

 

 

 

5

0.5

 

 

 

 

 

2

 

 

 

 

 

1

 

 

 

MGD059

 

 

 

 

 

 

 

 

Fig.7 Input impedance derived from input reflection coefficient (S11), co-ordinates in ohms × 75; typical values.

1

0.5

2

0.2

 

 

 

 

 

 

5

 

 

 

500

 

 

10

+ j

 

 

 

 

 

0

 

300

700

 

 

 

 

 

 

 

 

 

0.2

0.5

1

100

2

5

10

 

– j

 

 

 

860 MHz

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

0.2

 

 

 

 

 

 

5

0.5

 

 

 

 

2

 

 

 

 

1

 

 

 

MGD060

 

 

 

 

 

 

 

Fig.8 Output impedance derived from output reflection coefficient (S22), co-ordinates in ohms × 75; typical values.

1995 Nov 13

6

Philips Semiconductors

Product specification

 

 

Wideband amplifier module

OM2050

 

 

MOUNTING

Dip or wave soldering

The module should preferably be mounted on a double-sided printed-circuit board, see Fig.3.

Input and output should be connected to 75 Ω tracks. The connection to the common pins should be as close to the seating plane as possible.

SOLDERING

Hand soldering

The maximum contact time for a soldering iron temperature of 260 °C up to the seating plane is 5 s.

PACKAGE OUTLINE

The maximum permissible temperature for the solder is 260 °C. It must not be in contact with the joint for more than 5 s.

The total contact time of successive solder waves must not exceed 5 s.

The device may be mounted against the printed-circuit board, but the temperature of the device must not exceed 125 °C.

If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature below the allowable limit.

seating plane

19 max

3

max

 

9 max

4.5

 

 

 

 

 

 

3.0

1

2

3

4

5

 

0.56

 

 

 

 

 

0.2

0.40

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.54

MGD054

 

 

 

 

 

(6x)

 

Dimensions in mm.

Fig.9 Resin coated encapsulation.

1995 Nov 13

7

Philips Semiconductors

 

Product specification

 

 

 

Wideband amplifier module

OM2050

 

 

 

DEFINITIONS

 

 

 

 

 

Data sheet status

 

 

 

 

Objective specification

This data sheet contains target or goal specifications for product development.

 

 

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

 

 

 

Product specification

This data sheet contains final product specifications.

 

 

 

 

Limiting values

 

 

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1995 Nov 13

8

Philips Semiconductors

Product specification

 

 

Wideband amplifier module

OM2050

 

 

 

NOTES

1995 Nov 13

9

Philips Semiconductors

Product specification

 

 

Wideband amplifier module

OM2050

 

 

 

NOTES

1995 Nov 13

10

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