Материал: mmqa5v6t1rev3
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MMQA5V6T1/D
5.6 Volt SC 59 Quad Monolithic
Common Anode
MMQA5V6T1
MMQA20VT1
Motorola Preferred Devices
Transient Voltage Suppressor for ESD Protection
This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium.
Specification Features:
•SC-59 Package Allows Four Separate Unidirectional Configurations
•Peak Power Ð 24 Watts @ 1.0 ms (Unidirectional), per Figure 7 Waveform
•Maximum Clamping Voltage @ Peak Pulse Current
•Low Leakage < 2.0 μA
•ESD Rating of Class N (exceeding 16 kV) per the Human Body Model
SC-59 QUAD
TRANSIENT VOLTAGE
SUPPRESSOR
5.6 VOLTS (4)
24 WATTS PEAK POWER
6 5
4
1 2 
3
CASE 318F-01
STYLE 1
SC-59 PLASTIC
Mechanical Characteristics:
•Void Free, Transfer-Molded, Thermosetting Plastic Case
•Corrosion Resistant Finish, Easily Solderable
•Package Designed for Optimal Automated Board Assembly
•Small Package Size for High Density Applications
•Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel. Replace with ªT3º in the Device Number to order the 13 inch/10,000 unit reel.
THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
1 |
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PIN 1. CATHODE
2.ANODE
3.CATHODE
4.CATHODE
5.ANODE
6.CATHODE
Characteristic |
Symbol |
Value |
Unit |
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Peak Power Dissipation @ 1.0 ms (1) |
Ppk |
24 |
Watts |
@ TA ≤ 25°C |
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Total Power Dissipation on FR-5 Board (2) @ TA = 25°C |
°PD° |
°225 |
°mW° |
Derate above 25°C |
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1.8 |
mW/°C |
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Thermal Resistance Junction to Ambient |
RθJA |
556 |
°C/W |
Total Power Dissipation on Alumina Substrate (3) @ TA = 25°C |
°PD° |
°300 |
°mW |
Derate above 25°C |
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2.4 |
mW/°C |
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Thermal Resistance Junction to Ambient |
RθJA |
417 |
°C/W |
Junction and Storage Temperature Range |
TJ |
°± 55 to +150° |
°C |
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Tstg |
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Lead Solder Temperature Ð Maximum (10 Second Duration) |
TL |
260 |
°C |
1.Non-repetitive current pulse per Figure 7 and derate above TA = 25°C per Figure 8.
2.FR-5 = 1.0 x 0.75 x 0.62 in.
3.Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
4.Other voltages are available
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 3
Motorola, Inc. 1996
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA)
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Breakdown Voltage |
Max Reverse |
Max Zener Impedance (5) |
Max |
Max Reverse |
Maximum |
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Leakage Current |
Voltage @ |
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Reverse |
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IRSM(4) |
Temperature |
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Surge |
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VZT(3) |
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(Clamping |
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IR @ VR |
ZZT @ IZT |
Current |
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(V) |
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@ I ZT |
Voltage) |
VZ |
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IRSM(4) |
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(mA) |
(μA) |
(V) |
(Ω) (mA) |
VRSM |
(mV/°C) |
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Min |
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Nom |
Max |
1 |
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(A) |
(V) |
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5.32 |
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5.6 |
5.88 |
1.0 |
2.0 |
3.0 |
400 |
3.0 |
8.0 |
1.26 |
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19 |
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20 |
21 |
1.0 |
0.1 |
15 |
125 |
0.84 |
28.6 |
20.07 |
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(3)VZ measured at pulse test current IT at an ambient temperature of 25°C.
(4)Surge current waveform per Figure 5 and derate per Figure 6.
(5)ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specfied limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz.
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Typical Characteristics |
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VZ @ IT |
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23 |
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(VOLTS) |
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(VOLTS) |
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MMQA20VT1 |
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MMQA5V6T1 |
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VOLTAGE |
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VOLTAGE |
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, BREAKDOWN |
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, BREAKDOWN |
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UNIDIRECTIONAL |
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Z |
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Z |
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V |
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V |
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4 |
0 |
50 |
100 |
150 |
17 |
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25 |
150 |
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± 40 |
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TA, AMBIENT TEMPERATURE (°C) |
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TA, AMBIENT TEMPERATURE (°C) |
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Figure 1. Typical Breakdown Voltage |
Figure 2. Typical Breakdown Voltage |
versus Temperature |
versus Temperature |
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10000 |
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CURRENT (nA) |
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REVERSE LEAKAGE |
1000 |
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R, |
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I |
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100 |
0 |
50 |
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TA, AMBIENT TEMPERATURE (°C) |
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Figure 3. Typical Leakage Current
versus Temperature
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70 |
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60 |
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(pF) |
50 |
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MMQA20VT1 |
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C, CAPACITANCE |
40 |
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UNIDIRECTIONAL |
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REVERSE VOLTAGE (V)
Figure 4. Typical Capacitance versus
Reverse Voltage
MOTOROLA |
MMQA5V6T1 MMQA20VT1 |
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Typical Characteristics |
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300 |
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300 |
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275 |
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(pF) |
250 |
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MMQA5V6T1 |
(mW) |
250 |
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225 |
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ALUMINA SUBSTRATE |
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CAPACITANCEC, |
200 |
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UNIDIRECTIONAL |
DISSIPATIONPOWER |
200 |
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175 |
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150 |
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150 |
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125 |
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100 |
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100 |
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75 |
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FR-5 BOARD |
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D |
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P |
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0 |
0.5 |
1 |
1.5 |
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2.5 |
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REVERSE VOLTAGE (V) |
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TA, AMBIENT TEMPERATURE (°C) |
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Figure 5. Typical Capacitance versus |
Figure 6. Steady State Power Derating Curve |
Reverse Voltage
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PULSE WIDTH (tP) IS DEFINED |
POWER |
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tr |
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AS THAT POINT WHERE THE |
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PEAK CURRENT DECAYS TO 50% |
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OF PEAK |
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100 |
PEAK VALUE Ð I RSM |
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OF IRSM. |
C |
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tr ≤ 10 |
μs |
= 25 |
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DERATINGIN % |
A |
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HALF VALUE Ð |
IRSM |
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CURRENT@ T |
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(%)VALUE |
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tP |
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PULSE |
OR |
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1 |
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PEAK |
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t, TIME (ms) |
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100 |
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90 |
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TA, AMBIENT TEMPERATURE (°C) |
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Figure 7. Pulse Waveform |
Figure 8. Pulse Derating Curve |
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RECTANGULAR |
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POWER (W) |
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WAVEFORM, TA = 25°C |
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SURGE |
10 |
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UNIDIRECTIONAL |
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Ppk PEAK |
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1.0 |
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10 |
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PW, PULSE WIDTH (ms)
Figure 9. Maximum Non-repetitive Surge
Power, Ppk versus PW
Power is defined as VRSM x IZ(pk) where VRSM is the clamping voltage at IZ(pk).
MMQA5V6T1 MMQA20VT1 |
MOTOROLA |
|
3
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SC-59 package protects four separate lines using only one package. This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples of MMQA5V6T1 and MMQA20VT1 applications are illustrated below.
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Computer Interface Protection |
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A |
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KEYBOARD |
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B |
FUNCTIONAL |
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TERMINAL |
I/O |
C |
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PRINTER |
DECODER |
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ETC. |
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GND |
MMQA5V6T1 |
MMQA20VT1 |
Microprocessor Protection
VDD
VGG
ADDRESS BUS
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RAM |
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DATA BUS
CPU
I/O
CLOCK
CONTROL BUS
GND
MMQA5V6T1
MMQA20VT1
MOTOROLA |
MMQA5V6T1 MMQA20VT1 |
4
INFORMATION FOR USING THE SC-59 6 LEAD SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process.
0.037 |
0.95 |
0.074 |
1.9 |
0.037 |
0.95 |
0.094
2.4
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0.028 |
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0.7 |
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0.039 |
inches |
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SC-59 6 LEAD
SC-59 6 LEAD POWER DISSIPATION
The power dissipation of the SC-59 6 Lead is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined
by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to
ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SC-59 6 Lead package, PD can be calculated as follows:
TJ(max) ± TA
PD = RθJA
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this case is 225 milliwatts.
PD = 150°C ± 25°C = 225 milliwatts 556°C/W
The 556°C/W for the SC-59 6 Lead package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SC-59 6 Lead package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the
SC-59, SC-59 6 Lead, SC-70/SOT-323, SOD-123, SOT-23, SOT-143, SOT-223, SO-8, SO-14, SO-16, and SMB/SMC diode packages, the stencil opening should be the same as the pad size or a 1:1 registration.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected.
•Always preheat the device.
•The delta temperature between the preheat and soldering should be 100°C or less.*
•When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
* Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
MMQA5V6T1 MMQA20VT1 |
MOTOROLA |
|
5