Материал: 9676

Внимание! Если размещение файла нарушает Ваши авторские права, то обязательно сообщите нам

Philips Semiconductors

Product specification

 

 

Triacs

BT139X series

 

 

 

 

GENERAL DESCRIPTION

QUICK REFERENCE DATA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Glass passivated triacs in a full pack,

 

SYMBOL

 

PARAMETER

 

 

 

MAX.

MAX.

MAX.

UNIT

plastic envelope, intended for use in

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BT139X-

500

 

600

 

 

800

 

 

 

 

applications

requiring

high

 

 

 

 

 

 

 

 

 

 

 

 

bidirectional

transient and

blocking

 

 

 

 

 

BT139X-

500F

600F

800F

 

 

 

voltage capability and high thermal

 

 

 

 

 

BT139X-

 

500G

 

600G

800G

 

 

 

cycling

performance.

Typical

 

VDRM

 

Repetitive peak off-state

 

500

 

 

600

 

 

800

 

 

V

applications

include motor

control,

 

 

 

 

voltages

 

 

 

 

 

 

 

 

 

 

 

 

 

 

industrial

and domestic

lighting,

 

IT(RMS)

 

RMS on-state current

 

16

 

 

16

 

 

16

 

 

A

heating and static switching.

 

 

ITSM

 

Non-repetitive peak on-state

 

140

 

 

140

 

 

140

 

 

A

 

 

 

 

 

 

 

 

current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PINNING - SOT186A

 

PIN CONFIGURATION

SYMBOL

 

 

 

 

 

 

 

 

PIN DESCRIPTION

1main terminal 1

2main terminal 2

3gate

case isolated

case

T2

T1

1 2 3

G

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

 

MAX.

 

UNIT

 

 

 

 

 

 

 

 

 

 

 

 

-500

-600

-800

 

V

Repetitive peak off-state

 

-

5001

6001

800

V

DRM

voltages

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

full sine wave; Ths 38 ˚C

 

 

 

 

 

IT(RMS)

RMS on-state current

-

 

16

 

A

ITSM

Non-repetitive peak

full sine wave; Tj = 125 ˚C prior

 

 

 

 

 

 

on-state current

to surge; with reapplied VDRM(max)

-

 

140

 

A

 

 

t = 20 ms

 

 

 

 

t = 16.7 ms

-

 

150

 

A

I2t

I2t for fusing

t = 10 ms

-

 

98

 

A2s

dIT/dt

Repetitive rate of rise of

ITM = 20 A; IG = 0.2 A;

 

 

 

 

 

 

on-state current after

dIG/dt = 0.2 A/μs

 

 

 

 

A/μs

 

triggering

T2+ G+

-

 

50

 

 

 

T2+ G-

-

 

50

 

A/μs

 

 

T2- G-

-

 

50

 

A/μs

 

 

T2- G+

-

 

10

 

A/μs

IGM

Peak gate current

 

-

 

2

 

A

VGM

Peak gate voltage

 

-

 

5

 

V

PGM

Peak gate power

 

-

 

5

 

W

PG(AV)

Average gate power

over any 20 ms period

-

 

0.5

 

W

Tstg

Storage temperature

 

-40

 

150

 

˚C

Tj

Operating junction

 

-

 

125

 

˚C

 

temperature

 

 

 

 

 

 

1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/μs.

February 1996

1

Rev 1.100

Philips Semiconductors

Product specification

 

 

Triacs

BT139X series

 

 

ISOLATION LIMITING VALUE & CHARACTERISTIC

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Visol

R.M.S. isolation voltage from all

f = 50-60 Hz; sinusoidal

-

 

2500

V

 

three terminals to external

waveform;

 

 

 

 

 

heatsink

R.H. 65% ; clean and dustfree

 

 

 

 

 

 

 

 

 

 

 

Cisol

Capacitance from T2 to external

f = 1 MHz

-

10

-

pF

 

heatsink

 

 

 

 

 

THERMAL RESISTANCES

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Rth j-hs

Thermal resistance

full or half cycle

-

-

4.0

K/W

 

junction to heatsink

with heatsink compound

 

 

without heatsink compound

-

-

5.5

K/W

Rth j-a

Thermal resistance

in free air

-

55

-

K/W

 

junction to ambient

 

 

 

 

 

STATIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

 

MAX.

 

UNIT

 

 

 

BT139X-

 

 

...

...F

...G

 

IGT

Gate trigger current

VD = 12

V; IT = 0.1 A

-

5

35

25

50

mA

 

 

 

T2+ G+

 

 

 

T2+ G-

-

8

35

25

50

mA

 

 

 

T2- G-

-

10

35

25

50

mA

 

 

 

T2- G+

-

22

70

70

100

mA

IL

Latching current

VD = 12

V; IGT = 0.1 A

-

7

40

40

60

mA

 

 

 

T2+ G+

 

 

 

T2+ G-

-

20

60

60

90

mA

 

 

 

T2- G-

-

8

40

40

60

mA

 

 

 

T2- G+

-

10

60

60

90

mA

IH

Holding current

VD = 12

V; IGT = 0.1 A

-

6

30

30

60

mA

VT

On-state voltage

IT = 20 A

-

1.2

 

1.6

 

V

VGT

Gate trigger voltage

VD = 12

V; IT = 0.1 A

-

0.7

 

1.5

 

V

 

 

VD = 400 V; IT = 0.1 A;

0.25

0.4

 

-

 

V

ID

 

Tj = 125 ˚C

 

 

 

 

 

 

Off-state leakage current

VD = VDRM(max);

-

0.1

 

0.5

 

mA

 

 

Tj = 125 ˚C

 

 

 

 

 

 

February 1996

2

Rev 1.100

Philips Semiconductors

Product specification

 

 

Triacs

BT139X series

 

 

DYNAMIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated

SYMBOL

PARAMETER

CONDITIONS

 

MIN.

 

TYP.

MAX.

UNIT

 

 

BT139X-

...

...F

...G

 

 

V/μs

dVD/dt

Critical rate of rise of

VDM = 67% VDRM(max);

100

50

200

250

-

 

off-state voltage

Tj = 125 ˚C; exponential

 

 

 

 

 

 

 

 

waveform; gate open

 

 

 

 

 

 

 

 

circuit

 

 

 

 

 

V/μs

dVcom/dt

Critical rate of change of

VDM = 400 V; Tj = 95 ˚C;

-

-

10

20

-

 

commutating voltage

IT(RMS) = 16 A;

 

 

 

 

 

 

 

 

dIcom/dt = 7.2 A/ms; gate

 

 

 

 

 

 

 

 

open circuit

 

 

 

 

 

μs

tgt

Gate controlled turn-on

ITM = 20 A; VD = VDRM(max);

-

-

-

2

-

 

time

IG = 0.1 A; dIG/dt = 5 A/μs

 

 

 

 

 

 

February 1996

3

Rev 1.100

Philips Semiconductors

Product specification

 

 

Triacs

BT139X series

 

 

25

Ptot / W

 

BT139

 

Ths(max) / C 25

 

 

 

 

 

 

 

 

= 180

 

20

 

 

 

 

120

45

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

90

 

15

 

 

 

 

60

65

 

 

 

 

 

 

10

 

 

 

 

30

85

 

 

 

 

 

5

 

 

 

 

 

105

0

0

5

10

15

 

125

 

 

20

 

 

 

IT(RMS) / A

 

 

 

Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where α = conduction angle.

1000

ITSM / A

 

BT139

 

 

100

 

 

 

 

 

 

 

dIT/dt limit

 

 

 

 

 

T2- G+ quadrant

 

IT

ITSM

 

 

 

 

 

 

 

 

 

T

time

10

 

 

 

Tj initial = 125 C max

 

100us

1ms

10ms

100ms

10us

 

 

 

T / s

 

 

Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp 20ms.

150

ITSM / A

 

BT139

 

 

 

 

IT

ITSM

 

 

 

T

time

100

 

 

Tj initial = 125 C max

 

 

 

50

 

 

 

 

0

1

10

100

1000

 

 

Number of cycles at 50Hz

 

Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz.

IT(RMS) / A

 

BT139X

 

 

20

 

 

 

 

 

 

38 C

 

 

15

 

 

 

 

10

 

 

 

 

5

 

 

 

 

0

0

50

100

150

-50

 

 

Ths / C

 

 

Fig.4. Maximum permissible rms current IT(RMS) , versus heatsink temperature Ths.

50

IT(RMS) / A

BT139

 

 

40

 

 

 

 

30

 

 

 

 

20

 

 

 

 

10

 

 

 

 

0

 

0.1

1

10

0.01

 

 

surge duration / s

 

 

Fig.5. Maximum permissible repetitive rms on-state

current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Ths 38˚C.

 

VGT(Tj)

 

BT136

 

1.6

VGT(25 C)

 

 

1.4

 

 

 

 

 

1.2

 

 

 

 

 

1

 

 

 

 

 

0.8

 

 

 

 

 

0.6

 

 

 

 

 

0.4

 

0

50

100

150

-50

 

 

 

Tj /

C

 

Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.

February 1996

4

Rev 1.100

Philips Semiconductors

Product specification

 

 

Triacs

BT139X series

 

 

 

IGT(Tj)

 

 

 

 

3

IGT(25 C)

 

BT139

T2+ G+

 

 

 

 

 

 

2.5

 

 

 

T2+ G-

 

 

 

 

T2- G-

 

 

 

 

 

 

 

 

 

 

T2- G+

 

2

 

 

 

 

 

1.5

 

 

 

 

 

1

 

 

 

 

 

0.5

 

 

 

 

 

0

 

0

50

100

150

-50

 

 

 

Tj / C

 

 

Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.

IL(Tj)

 

 

 

IL(25 C)

TRIAC

 

 

3

 

 

 

 

2.5

 

 

 

 

2

 

 

 

 

1.5

 

 

 

 

1

 

 

 

 

0.5

 

 

 

 

0

0

50

100

150

-50

 

 

Tj / C

 

 

Fig.8.

Normalised latching current IL(Tj)/ IL(25˚C),

 

versus junction temperature Tj.

 

IH(Tj)

 

 

 

3 IH(25C)

TRIAC

 

 

2.5

 

 

 

 

2

 

 

 

 

1.5

 

 

 

 

1

 

 

 

 

0.5

 

 

 

 

0

0

50

100

150

-50

 

 

Tj / C

 

 

Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), versus junction temperature Tj.

50

IT / A

 

BT139

 

Tj = 125 C

 

 

 

 

 

 

 

40

Tj = 25 C

 

typ

max

 

 

 

Vo = 1.195 V

 

 

 

 

 

 

 

 

Rs = 0.018 Ohms

 

 

 

30

 

 

 

 

 

 

 

 

 

 

20

10

0

0

0.5

1

1.5

2

2.5

3

 

 

 

VT / V

 

 

 

Fig.10. Typical and maximum on-state characteristic.

10

Zth j-hs (K/W)

 

BT139

 

 

 

 

with heatsink compound

 

 

 

 

without heatsink compound

 

 

 

1

 

 

unidirectional

bidirectional

 

 

 

 

 

 

 

 

 

0.1

 

 

 

 

 

 

 

 

 

 

 

P

t p

 

 

 

 

 

 

D

 

 

 

0.01

 

 

 

 

 

 

 

 

 

 

 

 

 

 

t

0.001

 

0.1ms

1ms

10ms

0.1s

1s

10s

10us

 

 

 

 

tp / s

 

 

 

Fig.11. Transient thermal impedance Zth j-hs, versus pulse width tp.

1000 dV/dt (V/us)

off-state dV/dt limit

BT139...G SERIES

BT139 SERIES

100

BT139...F SERIES

dIcom/dt =

 

 

 

 

 

20 A/ms

16

12

9.3

7.2

5.6

10

1 0

50

100

150

 

 

Tj / C

 

Fig.12. Typical commutation dV/dt versus junction temperature, parameter commutation dIT/dt. The triac should commutate when the dV/dt is below the value on the appropriate curve for pre-commutation dIT/dt.

February 1996

5

Rev 1.100

Источник: https://studfile.net/preview/16504427/