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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MCR12DCM/D

Silicon Controlled Rectifiers

Reverse Blocking Thyristors

Designed for high volume, low cost, industrial and consumer applications such as motor control; process control; temperature, light and speed control.

Small Size

 

Passivated Die for Reliability and Uniformity

 

Low Level Triggering and Holding Characteristics

A

Available in Two Package Styles

 

Surface Mount Lead Form Ð Case 369A

 

Miniature Plastic Package Ð Straight Leads Ð Case 369

 

ORDERING INFORMATION

G

To Obtain ªDPAKº in Surface Mount Leadform (Case 369A)

 

Shipped in Sleeves Ð No Suffix, i.e. MCR12DCN

K

Shipped in 16 mm Tape and Reel Ð Add ªT4º Suffix to Device Number,

 

i.e. MCR12DCNT4

 

To Obtain ªDPAKº in Straight Lead Version (Case 369) Shipped in Sleeves Ð Add ª±1º Suffix to Device Number, i.e. MCR12DCN±1

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

MCR12DCM

MCR12DCN

Motorola Preferred Devices

SCRs

12 AMPERES RMS

600 thru 800 VOLTS

A

K

A G

CASE 369A±13

STYLE 4

Rating

 

Symbol

Value

Unit

 

 

 

 

 

Peak Repetitive Off±State Voltage (1)

 

V

 

Volts

 

 

DRM

 

 

Peak Repetitive Reverse Voltage

 

VRRM

 

 

(TJ = ±40 to 125°C)

MCR12DCM

 

600

 

 

MCR12DCN

 

800

 

 

 

 

 

 

On±State RMS Current

 

IT(RMS)

 

Amps

(All Conduction Angles; TC = 90°C)

 

 

12

 

Average On±State Current (All Conduction Angles; TC = 90°C)

IT(AV)

7.6

 

Peak Non±Repetitive Surge Current

 

ITSM

 

 

(One Half Cycle, 60 Hz, TJ = 125°C)

 

 

100

 

Circuit Fusing Consideration (t = 8.3 msec)

 

I2t

41

A2sec

Peak Gate Power

 

PGM

 

Watts

(Pulse Width ≤ 10 msec, TC = 90°C)

 

 

5.0

 

Average Gate Power

 

PG(AV)

 

 

(t = 8.3 msec, TC = 90°C)

 

 

0.5

 

Peak Gate Current (Pulse Width ≤ 10 sec,m

TC = 90°C)

IGM

2.0

Amps

Operating Junction Temperature Range

 

TJ

±40 to 125

°C

Storage Temperature Range

 

Tstg

±40 to 150

 

THERMAL CHARACTERISTICS

 

 

 

 

Characteristic

Symbol

Max

Unit

 

 

 

 

Thermal Resistance Ð Junction to Case

RqJC

2.2

°C/W

Ð Junction to Ambient

RqJA

88

 

Ð Junction to Ambient (2)

RqJA

80

 

Maximum Lead Temperature for Soldering Purposes (3)

T

260

°C

 

L

 

 

(1)VDRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the device are exceeded.

(2)Surface mounted on minimum recommended pad size.

(3)1/8″ from case for 10 seconds.

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola Thyristor Device Data

Motorola, Inc. 1997

MCR12DCM MCR12DCN

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)

Characteristics

 

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

Peak Forward Blocking Current

 

IDRM

 

 

 

mA

Peak Reverse Blocking Current

TJ = 25°C

IRRM

 

 

 

 

(VAK = Rated VDRM or VRRM, Gate Open)

 

Ð

Ð

0.01

 

 

TJ = 125°C

 

Ð

Ð

5.0

 

Peak On±State Voltage (1)

 

V

 

 

 

Volts

(ITM = 24 A)

 

TM

Ð

1.4

2.1

 

 

 

 

Gate Trigger Current (Continuous dc)

 

IGT

 

 

 

mA

(VD = 12 V, RL = 100 W, TJ = 25°C)

 

 

2.0

7.0

20

 

(VD = 12 V, RL = 100 W, TJ = ±40°C)

 

 

Ð

Ð

40

 

Gate Trigger Voltage (Continuous dc)

 

VGT

 

 

 

Volts

(VD = 12 V, RL = 100 W, TJ = 25°C)

 

 

0.5

0.65

1.0

 

(VD = 12 V, RL = 100 W, TJ = ±40°C)

 

 

Ð

Ð

2.0

 

(VD = 12 V, RL = 100 W, TJ = 125°C)

 

 

0.2

Ð

Ð

 

Holding Current

 

IH

 

 

 

mA

(VD = 12 V, IT = 200 mA, TJ = 25°C)

 

 

4.0

22

40

 

(VD = 12 V, IT = 200 mA, TJ = ±40°C)

 

 

Ð

Ð

80

 

Latching Current

 

IL

 

 

 

mA

(VD = 12 V, IG = 20 mA, TJ = 25°C)

 

 

4.0

22

40

 

(VD = 12 V, IG = 40 mA, TJ = ±40°C)

 

 

Ð

Ð

80

 

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

Characteristics

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

Critical Rate of Rise of Off±State Voltage

dv/dt

 

 

 

V/ms

(VD = Rated VDRM, Exponential Waveform, Gate Open, TJ = 125°C)

 

50

200

Ð

 

(1) Pulse Test; Pulse Width 2.0 msec, Duty Cycle 2%.

2

Motorola Thyristor Device Data

°C)

125

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(

 

 

 

 

 

 

 

 

 

TEMPERATURE

120

 

 

 

 

 

 

 

 

115

 

 

 

 

 

 

 

 

110

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CASE

105

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

dc

 

ALLOWABLE

100

a

 

 

 

 

 

 

 

 

 

 

 

 

 

95

a = Conduction

 

 

 

 

 

 

90

Angle

 

 

 

 

 

 

 

MAXIMUM

 

a = 30°

60°

90°

120°

180°

 

85

 

 

1.0

2.0

3.0

 

 

 

 

 

0

4.0

5.0

6.0

7.0

8.0

,

 

 

 

 

 

 

 

 

 

C

 

IT(AV), AVERAGE ON±STATE CURRENT (AMPS)

 

T

 

 

 

 

 

 

 

MCR12DCM

MCR12DCN

(WATTS)

16

 

 

 

 

 

 

 

180°

 

 

 

 

 

 

 

 

14

 

 

 

 

90°

120°

 

 

DISSIPATION

12

 

 

 

 

 

 

 

 

a

 

 

60°

 

 

dc

 

a = Conduction

 

 

 

 

 

10

 

 

 

 

 

 

 

Angle

 

 

 

 

 

 

POWER

8.0

 

a = 30°

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6.0

 

 

 

 

 

 

 

 

, AVERAGE

4.0

 

 

 

 

 

 

 

 

2.0

 

 

 

 

 

 

 

 

(AV)

0

 

 

 

 

 

 

 

 

P

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

 

0

 

 

IT(AV), AVERAGE ON±STATE CURRENT (AMPS)

 

Figure 1. Average Current Derating

Figure 2. On±State Power Dissipation

IT, INSTANTANEOUS ON±STATE CURRENT (AMPS)

100

TYPICAL @ TJ = 25°C

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MAXIMUM @ TJ = 125°C

(NORMALIZED)

 

 

 

 

 

 

10

 

 

 

 

RESISTANCETRANSIENT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.1

 

 

 

 

 

 

 

MAXIMUM @ TJ = 25°C

 

 

 

 

 

 

 

S

r(t)

1.0

 

 

 

 

 

 

 

 

 

ZqJC(t) = RqJC(t)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

,

 

 

 

 

 

 

 

 

 

 

 

 

(t)

 

 

 

 

 

 

 

 

 

 

 

 

r

 

 

 

 

 

 

 

0.1

 

 

 

 

 

 

0.01

 

 

 

 

 

0

1.0

2.0

3.0

4.0

5.0

 

0.1

1.0

10

100

1000

10 K

 

VT, INSTANTANEOUS ON±STATE VOLTAGE (VOLTS)

 

 

 

 

t, TIME (ms)

 

 

Figure 3. On±State Characteristics

Figure 4. Transient Thermal Response

IGT, GATE TRIGGER CURRENT (mA)

100

10

1.0

 

 

 

 

35

 

 

 

 

 

 

±40

±25

±10

5.0

20

50

65

80

95

110

125

TJ, JUNCTION TEMPERATURE (°C)

Figure 5. Typical Gate Trigger Current versus Junction Temperature

VGT, GATE TRIGGER VOLTAGE (VOLTS)

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

±40

±25

±10

5.0

20

35

50

65

80

95

110

125

 

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

 

 

Figure 6. Typical Gate Trigger Voltage versus Junction Temperature

Motorola Thyristor Device Data

3

MCR12DCM MCR12DCN

CURRENT (mA)

100

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

, HOLDING

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

H

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

±10

 

 

 

 

35

 

 

 

 

80

 

 

 

 

 

 

 

±40

±25

5.0

20

50

65

95

110

125

TJ, JUNCTION TEMPERATURE (°C)

Figure 7. Typical Holding Current versus

Junction Temperature

CURRENT (mA)

100

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

, LATCHING

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

±40

±25

±10

5.0

20

35

50

65

80

95

110

125

TJ, JUNCTION TEMPERATURE (°C)

Figure 8. Typical Latching Current versus

Junction Temperature

1000

 

 

 

 

 

 

VD = 800 V

 

 

 

TJ = 125°C

s)

 

 

 

m

 

 

 

STATIC dv/dt (V/

 

 

 

100

 

 

 

10

100

1000

10 K

RGK, GATE±CATHODE RESISTANCE (OHMS)

Figure 9. Exponential Static dv/dt versus

Gate±Cathode Resistance

4

Motorola Thyristor Device Data

MCR12DCM MCR12DCN

PACKAGE DIMENSIONS

±T± SEATINGPLANE

 

B

C

V

R

E

 

4

 

Z

 

 

 

S

 

 

A

 

 

 

1

2

3

U

 

 

 

 

 

 

K

F

 

 

J

 

 

L

H

 

 

 

D 2 PL

G

0.13 (0.005) M T

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: INCH.

 

INCHES

MILLIMETERS

DIM

MIN

MAX

MIN

MAX

A

0.235

0.250

5.97

6.35

B

0.250

0.265

6.35

6.73

C

0.086

0.094

2.19

2.38

D

0.027

0.035

0.69

0.88

E

0.033

0.040

0.84

1.01

F

0.037

0.047

0.94

1.19

G

0.180 BSC

4.58 BSC

H

0.034

0.040

0.87

1.01

J

0.018

0.023

0.46

0.58

K

0.102

0.114

2.60

2.89

L

0.090 BSC

2.29 BSC

R

0.175

0.215

4.45

5.46

S

0.020

0.050

0.51

1.27

U

0.020

±±±

0.51

±±±

V

0.030

0.050

0.77

1.27

Z

0.138

±±±

3.51

±±±

STYLE 4:

PIN 1. CATHODE

2. ANODE

3. GATE

4. ANODE

CASE 369A±13

ISSUE Y

Motorola Thyristor Device Data

5

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